ADVANTAGES OF FLUID CIRCUITS IN PLASTIC Whether designing a custom fluid circuit or using a plastic air manifold, utilizing bonded-plastic technology offers advantages over traditional methods. The list below describes a few of the advantages:
IN ENGINEERING
Much more compact packaging
DURING MANUFACTURING
FOR THE CUSTOMER
ELIMINATES
REDUCES
ENHANCES
Plastic Bonding (chemical interfusion)
MicroAdvances uses a proprietary method of bonding plastic that is superior to other methods. It is a form of chemical bonding that achieves high bond strength. No permanent glues, cements or adhesives are used in the process. The result of our chemical interfusion bonding method actually fuses (interfuses) the plastic layers together, which basically results in one solid plastic piece. Destructive testing indicates that the bond joints are as strong as the plastic itself.
MicroAdvances chemical interfusion bonding method also results in polished grooves and internal features which allows clarity for inspection, better laminar flow and easier to clean channels.
Moreover, because we press-bond at low temperatures, the internal features do not deform, thus allowing close tolerances of internal features (most diffusion bonding methods heat the plastic until it softens, which can result in deformation of internal parts).
After bonding, the plates are heat annealed (without pressure being applied) which eliminates stress in the plastic. The chemical solvent evaporates during annealing leaving the plastic clean, clear, and dry.
MicroAdvances can also bond continuous or cast acrylic, or clear PVC.
The chart below compares MicroAdvances chemical interfusion bonding technique against other bonding methods:
MicroAdvances Chemical Interfusion Bonding Diffusion Bonding Cement or glue bonding Superior and consistent high strength bonds.
Polished grooves, and internal features
Low temperature bonding never distorts internal features. This allows for tight tolerances.
Annealed for stress reduction
Works for continuous or cast acrylic, clear PVC, polysulfone, and polyetherimide (Ultem®)
Good bond strength but requires critical surface tolerances, temperature control, and bonding pressures which, if done improperly, can delaminate the plastic over time.
Internal features deform during high temperature bonding.
Lot variations can easily occur because of slight changes of bonding conditions (and difficult to check).
Internal features retain their unpolished nature or machine marks.
Fair bond strength but can delaminate due to some chemicals that attack the glue joints.
Excess adhesive often extrudes into internal features.
Lack of adhesive can produce weak spots between layers.
Variations in adhesive thickness results in poor overall part thickness tolerance control.
Internal features retain their unpolished nature or machine marks.
 MicroAdvances, Inc. | 6073 N.W. 167 St., Bldg. C-21 | Miami, FL 33015 | Tel: 305-556-4801, Toll Free: 877-62MICRO, Fax: 877-60MICRO |